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1/17 www.rohm.com 2009.07 - rev.b ? 2009 rohm co., ltd. all rights reserved. power supply ic series for tft-lcd panels 5v input multi-channel system power supply ic BD8153EFV description the BD8153EFV is a system power supply ic for tft panels.a 1-ch ip ic providing a total of four voltages required for tft panels, i.e., logic voltage, sauce voltage, gate high-level, and gate low-level voltage, thus constructing a tft panel power supply with minimal components required. features (BD8153EFV) 1) operates in an operating voltage ra nge as low as 2.1 v to 6. 0 v. 2) incorporates a step-up dc/dc converter. 3) incorporates a 3.3-v regulator. 4) incorporates positive and negative-side charge pumps. 5) switching frequency of 1100 khz 6) dc/dc converter feedback voltage of 1.24 v 1% 7) incorporates a gate shading function 8) under-voltage lockout protection circuit 9) thermal shutdown circuit 10) overcurrent protection circuit 11) htssop-b24 package applications liquid crystal tv, pc monitor, and tft-lcd panel absolute maximum ratings (ta = 25c) parameter symbol limit unit power supply voltage vcc 7 v vo1 voltage vo1 19 v vo2 voltage vo2 32 v sw voltage vsw 19 v maximum junction temperature tjmax 150 c power dissipation pd 1100* mw operating temperature range topr -40 to 125 c storage temperature range tstg -55 to 150 c * reduced by 4.7 mw/c over 25c, when mounted on a glass epoxy board. (70 mm ? 70 mm ? 1.6 mm). recommended operating ranges parameter symbol limit unit min max power supply voltage vcc 2.1 6 v vo1 voltage vo1 8 18 v sw voltage vsw ? 18 v sw current isw ? 1.8 a vo2 voltage vo2 ? 30 v no.09035jbt09
BD8153EFV technical note 2/17 www.rohm.com 2009.07 - rev.b ? 2009 rohm co., ltd. all rights reserved. electrical characteristics (unless ot herwise specified, vcc = 5 v; vo1 = 15 v; vo2 = 25 v; ta = 25c) 1 dc/dc converter block parameter symbol limit unit conditions min. typ. max. [soft start] source current iso 6 10 14 a vss = 0.5 v sinking current isi 0.1 0.2 1. 0 ma vss = 0.5 v,vdd = 1.65 v [error amp] input bias current 1 i fb1 ? 0.1 0.5 a feedback voltage 1 v fb1 1.227 1.240 1.253 v buffer voltage gain av ? 200 ? v/v * sinking current ioi 25 50 100 a v fb = 1.5 v v comp = 0.5 v source current ioo -100 -50 -25 a v fb = 1.0 v v comp = 0.5 v [sw] on resistance n-channel r on_n 50 200 600 m ? * leak current n-channel i leakn ? ? 10 a vsw = 18 v maximum duty cycle d max 75 85 95 % [overcurrent protection] saw current limit insw 2 3 ? a * 2. regulator controller parameter symbol limit unit conditions min. typ. max. [error amp] vdd voltage vdd 3.2 3.3 3.4 v maximum base current i bmax 4 7 11 ma line regulation regi ? 10 30 mv vcc = 4.5 v to 5.5 v load regulation regl ? 10 50 mv io = 10 ma to 100 ma [under-voltage lockout protection] off threshold voltage v roff 1.7 1.8 1.9 v on threshold voltage v ron 1.6 1.7 1.8 v ? this product is not designed for protection against radio active rays. * design guarantee (no total shipment inspection is made.)
BD8153EFV technical note 3/17 www.rohm.com 2009.07 - rev.b ? 2009 rohm co., ltd. all rights reserved. electrical characteristics (unless ot herwise specified, vcc = 5 v; vo1 = 15 v; vo2 = 25 v; ta = 25c) 3.charge pump parameter symbol limit unit conditions min. typ. max. [error amp] input bias current 2 i fb2 ? 0.1 0.5 a input bias current 3 i fb3 ? 0.1 0.5 a feedback voltage 2 v fb2 1.183 1.240 1.307 v feedback voltage 3 v fb3 0.15 0.2 0.25 v [delay start block] source current i dso 3 5 7 a v dls = 0.5v sinking current i dsi 0.1 0.5 1.0 ma v dls = 0.5v startup voltage v st 0.45 0.60 0.75 v [switch] on resistance n-channel r on_nc 0.5 2 4 ? io = 10 ma * on resistance p-channel r on_pc 0.5 4 8 ? io = -10 ma * [diode] voltage of diode vf 600 710 800 mv io = 10 ma [gate shading block] on resistance n-channel r on_ngs 2 10 20 ? io = 10 ma * on resistance p-channel r on_pgs 2 10 20 ? io = -10 ma * leak current n-channel i leak_ng s ? ? 10 a leak current p-channel i leak_pg s ? ? 10 a high voltage igh vdd 0.7 vdd ? v low voltage igl ? 0 vdd 0.3 v input current iig 8 16.5 30 a ig = 3.3 v 4.overall parameter symbol limit unit conditions min. typ. max. [reference block] reference voltage v ref 1.215 1.240 1.265 v drive current i ref ? 23 ? ma v ref = 0 v load regulation ? v ? 1 10 mv i ref = -1 ma [oscillator] oscillating frequency fosc 0.94 1.1 1.265 mhz [oscillator] det 1 on threshold voltage v don1 1.7 1.8 1.9 v det 1 off threshold voltage v doff1 1.6 1.7 1.8 v det 2 on threshold voltage v don2 1.02 1.12 1.22 v det 2 off threshold voltage v doff2 0.90 1.00 1.10 v det 3 on threshold voltage v don3 0.25 0.30 0.35 v det 3 off threshold voltage v doff3 0.35 0.41 0.47 v det 4 on threshold voltage v don4 1.02 1.12 1.22 v det 4 off threshold voltage v doff4 0.90 1.00 1.10 v [device] average circuit current icc 0.5 2 5 ma no switching ? this product is not designed for protection against radio active rays. * design guarantee (no total shipment inspection is made.)
BD8153EFV technical note 4/17 www.rohm.com 2009.07 - rev.b ? 2009 rohm co., ltd. all rights reserved. output voltage : vcp[mv]. 0 40 80 120 160 200 0 20 40 60 80 100 input current : icp[ma] 1.22 1.23 1.24 1.25 1.26 - 50 - 25 0 25 50 75 100 125 ambient temperature : ta[ ] ref voltage : vref[v ] 0 2 4 6 8 10 01.534.56 supply voltage : vdd[v] supply current : idd[ma] 0 0.2 0.4 0.6 0.8 1 0 1.5 3 4.5 6 supply voltage : vcc [v] supply current : icc[ma] 125 25 -40 fig. 10 sw on resistance 0 40 80 120 160 200 0 0.2 0.4 0.6 0.8 1 sw current : isw [a] sw voltage : vsw [v] fig. 12 gate shading on voltage gs current : igs[ma] gs voltage : vgs[v] fig. 11 charge pump on voltage n channel p channel fig. 4 internal reference line regulation 0 0.4 0.8 1.2 1.6 01.534.56 supply voltage : vcc[v] ref voltage : vref[v] fig. 5 internal reference load regulation 0 0.4 0.8 1.2 1.6 0 5 10 15 20 25 30 ref current : iref[ma] ref voltage : vref[v] fig. 6 ss source current 0 2 4 6 8 10 12 01.534.56 supply voltage : vdd[v] ss source current : iss[ a] . fig. 7 dls source current 0 2 4 6 8 10 12 01.5 34.56 supply voltage : vdd[v] dls source current : idls[ a] fig. 8 switching frequency temperature 0 0.5 1 1.5 2 -50 - 25 0 25 50 75 100 125 ambient temperature : ta[ ] switchhing frequency : f [mhz] -40 fig. 9 reg current capacity 0 1 2 3 4 5 024 6810 base current : ibase[ma] vdd voltage : vdd[v] fig. 1 total supply current 1 fig. 3 internal reference temperature fig. 2 total supply current 2 125 25 -40 n channel p channel 0 20 40 60 80 100 0 0.2 0.4 0.6 0.8 1 reference data (unless otherwise specified, ta = 25c)
BD8153EFV technical note 5/17 www.rohm.com 2009.07 - rev.b ? 2009 rohm co., ltd. all rights reserved. reference data (unless otherwise specified, ta = 25c) 0 1 2 3 4 5 00.40.81.21.62 output current : idd[ma] output voltage : vdd[v] 11.5 11.6 11.7 11.8 11.9 12.0 12.1 12.2 12.3 12.4 12.5 23 456 supply voltage : vcc[v] vo1 voltage : vo1[v] fig. 16 vo1 load regulation 10 11 12 13 14 0 100 200 300 400 500 600 700 output current : io[ma] output voltage : vo1[v] 13v 12v 10.8v fig. 14 vdd load regulation fig. 15 vo1 line regulation fig. 19 power supply voltage vs max. output current capacity 0 400 800 1200 1600 1.534.56 supply voltage : vcc[v] maximum current : iomax[ma] fig. 20 vo2 line regulation 23.4 23.5 23.6 23.7 23.8 10 11.5 13 14.5 16 input voltage : vo1[v] output voltage : vo2[v] fig. 21 vo2 load regulation 23 23.2 23.4 23.6 23.8 24 0 50 100 150 output current : io2[ma] output voltage : vo2[v] fig. 22 negative-side charge pump line regulation -6.4 -6.3 -6.2 -6.1 -6 10 11 12 13 14 15 input voltage : vo1[v] output voltage : vo3[v] fig. 23 negative-side charge pump load regulation -6.4 -6.3 -6.2 -6.1 -6 0 50 100 150 200 output current : io[ma] output voltage : vo1[v] fig. 13 vo1 line regulation 0 5 10 15 0 1.5 3 4.5 6 supply voltage : vcc [v] output voltage : vdd [v] fig. 17 efficiency vs output current 60 70 80 90 100 2.5 3 3.5 4 4.5 5 5.5 6 supply voltage : vcc[v] efficiency [ % ] fig. 18 efficiency vs power supply voltage fig. 24 gate shading output waveform ig vo2gs 80 85 90 95 100 0 150 300 450 600 output current : io1[ma] efficiency [ % ] 10.8v 12v 13v
BD8153EFV technical note 6/17 www.rohm.com 2009.07 - rev.b ? 2009 rohm co., ltd. all rights reserved. pin assignments diagram block diagram fig. 25 pin arrangements and block diagram pin assignments and function pin no. pin name function pin no. pin name function 1 gnd ground pin 13 vo2 positive-side charge pump output 2 vdd ldo feedback input pin 14 vo2g s gate shading source output pin 3 base ldo base drive output pin 15 gsout gate shading sink output pin 4 vcc power supply input pin 16 c2h flying capacitor connection pin 5 dls capacity connection pin for delay start 17 c2l flying capacitor connection pin 6 comp dc/dc difference amplifier output 18 c1l flying capacitor connection pin 7 fb1 dc/dc feedback input 19 c1h flying capacitor connection pin 8 ss soft start capacitor connection pin 20 vo1 negative-side charge pump power supply input pin 9 pgnd ground pin 21 c3 negative-side charge pump driver output 10 sw switch output 22 gnd ground pin 11 ig gate shading input 23 fb3 negative-side charge pump feedback input 12 fb2 positive-side charge pump feedback input 24 ref internal standard output pin gnd vdd base vcc dls comp fb1 ss pgnd sw ig fb2 ref fb3 gnd c3 vo1 c1h c1l c2l gsout vo2gs vo2 c2h 1uf 4.7uf vdd=3.3v ig vo2 23.5v ( 30v max ) vo1=14.5v ( 18v max ) vcc 5v vref step-up tsd uvlo charge pump control 1 regulator ctl charge pump control 2 10uf 10uf 10uf 160k 15k 0.1uf 0.1uf 5.1k 1000 p f vcc 0.1uf 1uf 91k 18k 0.1uf 270k 16k 0.1uf 1uf vo1 vo1 ss ref comp vcc gnd gnd sw vo1 fb1 vo2 c2h c2l c1h c1 l fb2 c3 fb3 ref dls vcc 0.1uf start-up controller pgnd det2 1.1v 1.1v det4 gate shading controller r vo2g gsout 0.01uf vo2g det3 0.3v vo1 det1 1.8v pgnd base vo3=-5v vdd det2 det4 controller
BD8153EFV technical note 7/17 www.rohm.com 2009.07 - rev.b ? 2009 rohm co., ltd. all rights reserved. fig. 26 starting timing chart block function ? step-up controller a controller circuit for dc/dc boosting. the switching duty is controlled so that the feedback voltage fb1 is set to 1.24 v (typ.). a soft start operates at the time of starting. therefore, the switching duty is controlled by the ss pin voltage. ? charge pump control 1 a controller circuit for the positive-side charge pump. the switching amplitude is controlled so that the feedback voltage fb2 will be set to 1.24 v (typ.). the start delay time can be set in the dls terminal at the time of starting. when the dls voltage reaches 0.6 v (typ.), switch ing waves will be output from the c1l and c2l pins. ? charge pump control 2 a controller circuit for t he negative-side charge pump. the switching amplitude is controlled so that the feedback voltage fb2 will be set to 0.6 v (typ.). ? gate shading controller a controller circuit of gate shading. the vo2gs and gsout are in on/off control according to ig pin input. ? regulator control a regulator controller circuit for v dd voltage generation. the base pin current is controlled so that v dd voltage will be set to 3.3 v (typ.). ? det 1 to det 4 a detection circuit of each output volt age. this detected signal is used for the starting sequential circuit. ? start-up controller a control circuit for the starting sequence. controls to start in order of v cc ?vdd ? vo1 ? vo3 ? vo2. ? vref a block that generates internal refe rence voltage. 1.24v (typ.) is output. ? tsd/uvlo thermal shutdown/under-voltage lockout protection/circuit blocks. the thermal shutdown circuit is shut down at an ic internal temperature of 175c and reset at 160c. the under-voltage lockout protection circuit shuts down the ic when the vcc is 1.8 v (typ.) or below. starting sequence for malfunction prevention, starting logic control operat es so that each output will rise in order of v cc ? vdd ? vo1 ? vo3 ? vo2. as shown below, detectors det1 to det3 detect that the output on the detection side has reached 90% (typ.) of the set voltage, and starts the next block. starting sequence model vdd reg det1 ctl1 step up dc/dc vo1 det2 ctl2 negative charge pump vo3 det3 ctl3 positive charge pump vo2 vcc det4 clt4 5v 3.3v vcc vdd vo2 vo1 vo3 0 0 0
BD8153EFV technical note 8/17 www.rohm.com 2009.07 - rev.b ? 2009 rohm co., ltd. all rights reserved. selecting application components (1) setting the output l constant the coil to use for output is decided by the rating current i lr and input current maximum value i inmax of the coil. adjust so that i inmax + ? i l does not reach the rating current value i lr . at this time, ? i l can be obtained by the following equation. i l = 1 vcc ? vo-vcc ? 1 l vcc f set with sufficient margin because the coil value may have the dispersion of ? 30%. if the coil current exceeds the rating current i lr of the coil, it may damage the ic internal element. BD8153EFV uses the current mode dc/dc converter control and has the optimized design at the coil value. a coil inductance (l) of 4.7 h to 15 h is recommended from viewpoints of electric power efficiency, response, and stability. (2) output capacity settings for the capacitor to use for the output, select the capaci tor which has the larger value in the ripple voltage v pp allowance value and the drop voltage allowance value at th e time of sudden load change. output ripple voltage is decided by the following equation. v pp = i lmax ? r esr + 1 ? vcc ? (i lmax - i l ) fco vo 2 perform setting so that the voltage is within the allowable ripple voltage range. for the drop voltage during sudden load change; v dr , please perform the rough calculat ion by the following equation. vdr = i ? 10 us [v] co however, 10 s is the rough calculatio n value of the dc/dc response speed. please set the capacitance considering the sufficient margin so that these tw o values are within the standard value range. (3) selecting the input capacitor since the peak current flows between the input and output at the dc/dc converter, a capacitor is required to install at the input side. for the reason, the low esr capacitor is re commended as an input capacitor which has the value more than 10 f and less than 100 m ? . if a capacitor out of this range is select ed, the excessive ripple voltage is superposed on the input voltage, accordingly it may cause the malfunction of ic. however these conditions may vary according to the load current, input voltage, output voltage, inductance and switching frequency. be sure to perform the margin check using the actual product. [a] here, f is the switching frequency. [v] here, f is the switching frequency. fig. 27 coil current waveform fig. 28 output application circuit diagram l vcc i l vo co il i inmax + ? i l should not reach the rating value level ilr i inmax average current
BD8153EFV technical note 9/17 www.rohm.com 2009.07 - rev.b ? 2009 rohm co., ltd. all rights reserved. (4) setting r c , c c of the phase compensation circuit in the current mode control, si nce the coil current is controll ed, a pole (phase lag) made by the cr filter composed of the output capacitor and load resistor will be created in the low frequency range, and a zero (phase lead) by the output capacitor and esr of capacitor will be created in the high frequenc y range. in this case, to cancel the pole of the power amplifier, it is easy to compensate by adding the zero point with c c and r c to the output from the error amp as shown in the illustration. open loop gain characteristics pole at the power amplification stage when the output current reduces, the load resistance r o increases and the pole frequency lowers. error amp phase compensation characteristics zero at the power amplification stage when the output capacitor is set larger, the pole frequency lowers but the zero frequency will not change. (this is because the capacitor esr becomes 1/2 when the capacitor becomes 2 times.) it is possible to realize the stable feedback loop by canceling the pole fp(min.), which is cr eated by the output capacitor and load resistor, with cr zero compensation of the error amp as shown below. fz(amp.) = fp(min.) 1 = 1 2 ? ? rc ? cc 2 ? ? romax ? co 1 fp = 2 ? ? r o ? c o 1 fz(esr) = 2 ? ? e sr ? c o 1 fp(min) = 2 ? ? r omax ? c o [hz] ? at light load 1 fz(max) = 2 ? ? r omin ? c o [hz] ? at heavy load 1 fp(amp.) = 2 ? ? r c ? c c fp(min) fp(max) fz(esr) a 0 -90 0 gain [db] phase [deg] l out min l out max 0 0 a -90 gain [db] phase [deg] l v cc rc cc cin vcc,pvcc gnd,pgnd sw comp co esr ro vo fig. 29 gain vs phase fig. 30 application circuit diagram [hz] [hz] [hz] [hz]
BD8153EFV technical note 10/17 www.rohm.com 2009.07 - rev.b ? 2009 rohm co., ltd. all rights reserved. (5) regulator controller settings the ic incorporates a 3.3-v regulator controller, and a regu lator can be formed by using an external pnp transistor. design the current capability of the regulator wi th a margin according to the following formula. iomax = 7ma ? hfe [a] the hfe is the current gain of the external pnp transistor. 7 ma is the sinking current of the internal transistor. it is not necessary to use the regulator if the input voltage is 3.3 v. in that case, input 3.3 v to both vcc and vdd. when incorporating a regulator into the external transistor, input the output voltage into the regulator. (6) setting the soft start time soft start is required to prevent the co il current at the time of start from in creasing and the over shoot of the output voltage at the starting time. the relation between the capacity and soft start time is shown in the following figure. refer to the figure and set capacity c1.soft start is required to prevent the coil current at the time of start from increasing and the overshoot of the output vo ltage at the starting time. fig. 34 shows the relation between the capacitance and soft start time. please refer to it to set the capacitance. as the capacitance, 0.001f to 0.1f is recommended. if t he capacitance is set lower than 0.001f, the overshooting may occur on the output voltage. if the capacitance is set larger than 0.1f, the excessive back current flow may occur in the internal parasitic elements when the power is turned off and it may damage ic. when there is the activation relation (sequences) with other power supplies, be sure to use the high accuracy product (such as x5r). soft start time may vary according to the input voltage, load s, coils and output capacity. be sure to verify the operation using the actual product. ceramic capacitor with a capacity of 4.7 ? f or over 0.01 0.1 1 10 0.001 0.01 0.1 ss capacitance[uf] delay time[ms] fig. 34 ss pin capacitance vs delay time fig.31 fig.32 fig.33 3.3 v vcc base vdd to i n s i d e ic regulator controller to inside ic base ( open ) 5v vcc vdd voltage other than 3.3 v regulator controller 3 pin regulator regulator controller vcc=5 v vcc vdd vdd=3.3 v to i n s i d e ic
BD8153EFV technical note 11/17 www.rohm.com 2009.07 - rev.b ? 2009 rohm co., ltd. all rights reserved. fig. 35 (7) design of the feedback resistor constant refer to the following equation to set t he feedback resistor. as the setting range, 10 k ? to 330 k ? is recommended. if the resistor is set lower than a 10 k ? , it causes the reduction of power efficiency. if it is set more than 330 k ? , the offset voltage becomes larger by the input bias current 0.4 a(typ.) in the internal error amplifier. sep-up (8) positive-side charge pump settings bu8513efv incorporates a charge pump controller, thus making it possible to generate stable gate voltage. the output voltage is determined by the following formula. as the setting range, 10 k ? to 330 k ? is recommended. if the resistor is set lower than a 10k ? , it causes the reduction of power efficiency. if it is set more than 330 k ? , the offset voltage becomes larger by the input bias current 0. 4 a (typ.) in the internal error amp. in order to prevent output voltage overshooting, add capacitor c8 in parallel with r8. the recommended capacitance is 1000 pf to 4700 pf. if a capacitor outside this range is inserted, the output voltage may oscillate. by connecting capacitance to the dls, a rising delay time can be set for the positive-side charge pump. the delay time is determined by the following formula. ? delay time of charge pump block t delay t delay = ( c dls ? 0.6 )/5 a [s6] where, c dls is the external capacitance. (9) negative-side charge pump settings bu8513efv incorporates a charge pump co ntroller for negative voltage, thus maki ng it possible to generate stable gate voltage. the output voltage is determined by the following formula. as the setting range, 10 k ? to 330 k ? is recommended. if the resistor is set lower than a 10 k ? , it causes the reduction of power effi ciency. if it is se t more than 330 k ? , the offset voltage becomes larger by the input bias current 0.4 a (typ.) in the internal error amp. the delay time is internally fixed at 200 us. in order to prevent output voltage oversh ooting, insert capacitor c6 in parallel with r6. the recommended capacitance is 1000 pf to 4700 pf. if a capacitor outside this range is inserted, the output voltage may oscillate. vo = r8 + r9 ? 1.24 [v] r9 vo = r8 + r9 ? 1.24 [v] r9 vo3 = - r6 ? 1.04 + 0.2 v [v] r7 vo2 r8 r9 err reference voltage 1.24 v fb2 12 c8 1000 pf to 4700 pf vo3 r6 r7 err fb3 c6 1000 pf to 4700 pf 1.24 v ref 0.2 v 23 24 vo r8 r9 err reference voltage 1.24 v fb1 7 fig. 36 fig.37
BD8153EFV technical note 12/17 www.rohm.com 2009.07 - rev.b ? 2009 rohm co., ltd. all rights reserved. gate shading setting method the ig input signal allows the high-level and low-level contro l of the positive-side gate volt age. the slope of output can be set by the external rc. the recommended resistance set value is 200 ? to 5.1 k ? and the recommended capacitor set value is 0.001 f to 0.1 f. the aggravation of efficiency may be caused if settings outside this range are made. determine ? v by referring to the following value. the following calculation formula is used for ? v. v = vo2gs ( 1 - exp ( - twl ) ) [v] cr parameter symbol limit unit condition min typ max ig ?l? time twl 1 2 - s - ig ?h? time twh 1 18 - s - vo2gs ?h? to ?l voltage difference v - 10 - v twl = 2 s ,r = 500 ? * vo2gs ?l? to ?h? time tlh - 0.1 - s ? v = 10 v * timing standard value vo2 r gate shading control vo2gs gsout c ig ic from positive-side pump gate driver twh tlh vo2gs l h l v twl h ig fig. 39 fig. 38
BD8153EFV technical note 13/17 www.rohm.com 2009.07 - rev.b ? 2009 rohm co., ltd. all rights reserved. application examples *although we are confident that the applic ation circuit diagram reflects the best possible recommendations, be sure to verify circuit characteristics for your particular application. when a circuit is used modifying the externally connected circui t constant, be sure to decide allowing sufficient margins consi dering the dispersion of values by external parts as well as our ic including not only the static but also the transient characteristi c. for the patent, we have not acquired the suffici ent confirmation. please acknowledge the status. (a) input voltage 5 v (b) input voltage 3.3 v (c) when inserting pmos switch fig. 42 fi g .40 ref vdd vo1 vo2 vo2gs vo3 vdd vo1 vo2 vo2gs ref vo3 fi g .41 ref vdd vo1 vo2 vo2gs vo3
BD8153EFV technical note 14/17 www.rohm.com 2009.07 - rev.b ? 2009 rohm co., ltd. all rights reserved. vcc 120k ? 30k ? vcc i/o equivalent circuits 2.vdd 3.base 5.dls,8.ss 6.comp 7.fb1,12.fb2 10.sw 11.ig 13.vo2 14.vo2gs 15.gsout 16.c2h,19.c1h 17.c2l,18.c1l,21.c3 23.fb3 24.ref fig.43 vdd vdd vdd vdd vo2 vo2 vdd vo2 vdd vdd vo1 vo1 vdd vdd 200k ?
BD8153EFV technical note 15/17 www.rohm.com 2009.07 - rev.b ? 2009 rohm co., ltd. all rights reserved. operation notes 1) absolute ma ximum ratings use of the ic in excess of absolute ma ximum ratings such as the applied voltage or operating temperature range may result in ic damage. assumptions should not be made regardin g the state of the ic (short mode or open mode) when such damage is suffered. a physical safety measure such as a fu se should be implemented when use of the ic in a special mode where the absolute maximum ratings may be exceeded is anticipated. 2) gnd potential ensure a minimum gnd pin potentia l in all operating conditions. 3) setting of heat use a thermal design that allows for a suffic ient margin in light of the power dissipa tion (pd) in actual operating conditions. 4) pin short and mistake fitting use caution when orienting and positioning the ic for mounting on printed circuit boards. improper mounting may result in damage to the ic. shorts between output pins or between out put pins and the power supply and gnd pins caused by the presence of a foreign object may result in damage to the ic. 5) actions in strong magnetic field use caution when using the ic in the pres ence of a strong magnetic field as doi ng so may cause the ic to malfunction. 6) testing on application boards when testing the ic on an application boar d, connecting a capacitor to a pin with low impedance subjects the ic to stress. always discharge capacitors after each process or step. ground the ic during assembly steps as an antistatic measure, and use similar caution when transporting or st oring the ic. always turn the ic's power supply off before connecting it to or removing it from a jig or fixtur e during the inspection process. 7) ground wiring patterns when using both small signal and large current gnd patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the application's referenc e point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. be careful not to change the gnd wiring patterns of any external components. 8) this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p/n junctions are formed at the intersection of these p layers with the n layers of other elements to create a variety of parasitic elements. for example, when the resistors and transistors are connected to the pins as shown in fig. 44, a parasitic diode or a transistor operates by inversing the pin voltage and gnd voltage. the formation of parasitic elements as a result of the relationships of the potentials of different pins is an inevitable resul t of the ic's architecture. the operation of parasitic elements can cause interference with circuit operation as well as ic malfunction and damage. for these reasons, it is necessary to us e caution so that the ic is not used in a way that will trigger the operation of parasitic elements, such as the appl ication of voltages lower than the gnd (p board) voltage to input and output pins. 9) overcurrent protection circuits an over current protection circuit designed according to t he output current is incorporated for the prevention of ic destruction that may result in the event of load shorting. this protection circuit is effective in preventing damage due to sudden and unexpected accidents. however, the ic should not be used in applications charac terized by the continuous operation or transitioning of the protection circuits. at the time of thermal de signing, keep in mind that the current capabili ty has negative characteristics to temperatures. ( pin a ) gnd n p n n p+ p+ resistor parasitic element p :* :* parasitic elements ( pin b ) :* :* gnd c b e parasitic element gnd ( pin a ) :* :* gnd n p n n p 9 p 9 parasitic elements p substrate ( pin b ) c b e transistor (npn) :* :* n gnd fig.44 example of a simple monolithic ic architecture
BD8153EFV technical note 16/17 www.rohm.com 2009.07 - rev.b ? 2009 rohm co., ltd. all rights reserved. 10) thermal shutdown circuit this ic incorporates a built-in thermal shutdown circuit for th e protection from thermal destruction. the ic should be used within the specified power dissipation range. however, in t he event that the ic continues to be operated in excess of its power dissipation limits, the attendant rise in the chip's temperature tj will trigger the thermal shutdown circuit to turn off all output power elements. the circuit automatically resets once the chip's temperature tj drops. operation of the thermal shutdown ci rcuit presumes that the ic's absolut e maximum ratings have been exceeded. application designs should never make use of the thermal shutdown circuit. 11) testing on application boards at the time of inspection of t he installation boards, when the capacitor is c onnected to the pin with low impedance, be sure to discharge electricity per process because it may load stresses to the ic. always turn the ic's power supply off before connecting it to or removing it from a jig or fixture duri ng the inspection process. ground the ic during assembly steps as an antistatic measure, and use similar cautio n when transporting or storing the ic. power dissipation reduction fig.45 ambient temperature :ta [ ] power dissipation :pd[mw 0 50 75 100 125 400 800 1100 200 600 25 on 70701.6mm glass-epoxy pcb 1200 150 1000
BD8153EFV technical note 17/17 www.rohm.com 2009.07 - rev.b ? 2009 rohm co., ltd. all rights reserved. ordering part number b d 8 1 5 3 e f v - e 2 part no. part no. package efv:htssop-b24 packaging and forming specification e2: embossed tape and reel (unit : mm) htssop-b24 0.65 1.0max 0.850.05 0.080.05 0.24 +0.05 - 0.04 0.08 m s 0.08 1.00.2 0.530.15 0.17 +0.05 - 0.03 4 + 6 ? 4 s 24 13 112 0.325 (3.4) (5.0) 7.80.1 7.60.2 5.60.1 (max 8.15 include burr) 1pin mark ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape (with dry pack) tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs e2 () direction of feed reel 1pin
r0039 a www.rohm.com ? 2009 rohm co., ltd. all rights reserved. notice rohm customer support system http://www.rohm.com/contact/ thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact us. notes no copying or reproduction of this document, in part or in whole, is permitted without the consent of rohm co.,ltd. the content specified herein is subject to change for improvement without notice. the content specified herein is for the purpose of introducing rohm's products (hereinafter "products"). if you wish to use any such product, please be sure to refer to the specifications, which can be obtained from rohm upon request. examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the products. the peripheral conditions must be taken into account when designing circuits for mass production. great care was taken in ensuring the accuracy of the information specified in this document. however, should you incur any damage arising from any inaccuracy or misprint of such information, rohm shall bear no responsibility for such damage. the technical information specified herein is intended only to show the typical functions of and examples of application circuits for the products. rohm does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by rohm and other parties. rohm shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. the products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, commu- nication devices, electronic appliances and amusement devices). the products specified in this document are not designed to be radiation tolerant. while rohm always makes efforts to enhance the quality and reliability of its products, a product may fail or malfunction for a variety of reasons. please be sure to implement in your equipment using the products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any product, such as derating, redundancy, fire control and fail-safe designs. rohm shall bear no responsibility whatsoever for your use of any product outside of the prescribed scope or not in accordance with the instruction manual. the products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). rohm shall bear no responsibility in any way for use of any of the products for the above special purposes. if a product is intended to be used for any such special purpose, please contact a rohm sales representative before purchasing. if you intend to export or ship overseas any product or technology specified herein that may be controlled under the foreign exchange and the foreign trade law, you will be required to obtain a license or permit under the law.

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